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MC1496, MC1496B
PACKAGE DIMENSIONS
SOIC ? 14
CASE 751A ? 03
ISSUE H
14
1
? A ?
8
? B ?
7
P 7 PL
0.25 (0.010)
M
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
? T ?
SEATING
PLANE
G
D 14 PL
0.25 (0.010)
M
K
T B
C
S
A
S
R X 45 _
M
J
F
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN MAX
8.55 8.75
3.80 4.00
1.35 1.75
0.35 0.49
0.40 1.25
1.27 BSC
0.19 0.25
0.10 0.25
0 _ 7 _
5.80 6.20
0.25 0.50
INCHES
MIN MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0 _ 7 _
0.228 0.244
0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
13
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